
PROCESSED CERAMIC SUBSTRATES
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This process is performed on 96% Alumina, 99.6% Alumina, BeO, Aluminum Nitride, and other exotic materials. The substrate is typically scribed to a depth that will enable the pattern to be snapped into individual devices after further batch processing by the customer. We often drill and machine the substrate at the same time, to produce other designed features for the finished device. The hybrid microelectronics industry is the largest market for this process, but we have supplied scribed, drilled, and machinined substrates to a variety of industries looking for speed, precision, and quick-turn services.
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