The diamond saw process is used to obtain the finest edge quality on the finished product. There are many reasons why this may be desirable. For example, singulation of finished devices, or in-process devices where edge quality and debris are an issue.

Dicing of cells as small as .01 X .01 X .01 is achievable, and a kerf width tolerance of ±.0002 is easily maintained.

Material structure determines quality. For exact specifications and tolerance, contact an ALT sales representative.