Applied Laser Technology  Applied Laser Technology, Inc.®
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processes

At right is a list and description of the primary processes used at ALT.  One or more of these processes may be appropriate for your application.  We would welcome the opportunity to discuss these and other processes with you.  Call our sales department or send an email for a technical discussion or a quotation.

3D Machining

The laser process is uniquely qualified to perform two and three dimensional micromachining of complex patterns in a variety of materials. The pattern shown here was machinined in Aluminum, and wit...

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3D machining
Laser Resistor Trimming

Laser trimming is the process of modifying the current path through a resistor with the laser beam. This is accomplished by changing the shape of the resistor and essentially reducing width and ad...

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Laser Trimming
Cleaning
Advances in medical technology have dramatically increased the need for precise laser processing. This is especially true for implantable devices. In many cases, the ability of the excimer laser to ...

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Cleaning with Lasers
Marking
In many cases, the marking process is an adjunct to another process we are performing, It might include barcoding, part numbering, lot identification, date codes or serialization. There are advan...

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Laser Marking
Drilling
There are several methods for drilling holes with a laser. These include laser punching, spiraling, and trepanning. Each method has advantages depending on the material, the size of the hole require...

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Laser Drilling
Dicing

The diamond saw process is used to obtain the finest edge quality on the finished product. There are many reasons why this may be desirable. For example, singulation of finished devices, or in-pr...

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Wafer Dicing
Patterning
Patterning is typically cutting a shape into a thin material. The laser excels at this process because of speed, versatility, and the lack of any special tooling requirements. ALT has the advantage ...

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Laser Patterning
Micromachining
Micromachining is a broad description for highly precise removal of various common and advanced materials through laser/material interaction. This can include patterning, drilling, slotting,...

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Laser Cutting
CERAMIC SCRIBING
This process is performed on 96% Alumina, 99.6% Alumina, BeO, Aluminum Nitride, and other exotic materials. The substrate is typically scribed to a depth that will enable the pattern to be snapped in...

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ceramic scribing