Diamond Dicing
Technology
Diamond Sawing is a technology used for dicing or scribing a variety of substrate materials, either before or after products have been patterned or plated, to achieve the superior quality required in high-precision applications.
This process, when correctly applied, induces no stress and provides a high-quality edge, free of particles. Using state-of-the-art equipment and expertise, ALT can deliver custom dicing or scribing dimensions as small as .008" x .008" x .008", and a kerf-width tolerance of ±.0002".
Materials
ALT specializes in processing a variety of substrate materials, sizes and thicknesses, including:
- Alumina
- Aluminum Nitride
- Beryllium
- Ceramic
- Copper
- Ferrite
- Gallium Arsenide (GaAs)
- Garnet
- Lithium Niobate
- Piezoceramic & Piezoelectric Materials (PZT)
- Plastic
- Pyrex
- Quartz
Please contact us with the material specifications you require. ALT can source materials, or process customer-supplied materials. In cases where material machining properties are not yet known, a fast turnaround, free trial can be arranged.